Invention Grant
- Patent Title: Manufacturing method of crimping terminal
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Application No.: US15725794Application Date: 2017-10-05
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Publication No.: US10923871B2Publication Date: 2021-02-16
- Inventor: Yuta Okuda , Keiichiroh Kurashige , Kazuhide Takahashi , Hirohito Nakata , Syunsuke Yaoita
- Applicant: Yazaki Corporation
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Kenealy Vaidya LLP
- Priority: JP2016-201868 20161013
- Main IPC: H01R43/048
- IPC: H01R43/048 ; H01R4/18

Abstract:
A manufacturing method of a crimping terminal includes a terminal supply step of supplying the crimping terminal to a crimping position with a wire by a terminal supply device, the crimping terminal including a terminal connection portion, a wire connection portion to be crimped onto the wire, and a joint portion linking side walls of the terminal connection portion and the wire connection portion, a support step of supporting a bottom portion of the crimping terminal supplied to the crimping position by a first mold, a crimp step of deforming the wire connection portion while relatively moving toward the first mold, and crimping the wire connection portion onto the wire by a second mold, and a regulation step of regulating a width of the joint portion so as not to be wider than a width of the terminal connection portion, by sandwiching the joint portion from both sides in a width direction when the second mold crimps the wire connection portion by a regulation portion.
Public/Granted literature
- US20180109058A1 MANUFACTURING METHOD OF CRIMPING TERMINAL Public/Granted day:2018-04-19
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