A circuit arrangement is enclosed. The circuit arrangement includes a first electronic circuit; a second electronic circuit; and a coupling circuit connected between the first electronic circuit and the second electronic circuit. The first electronic circuit is at least partially integrated in a first region of a semiconductor layer, the second electronic circuit is at least partially integrated in a second region of the semiconductor layer, and the second region adjoins a first insulating layer formed on a first surface of the semiconductor layer and is electrically insulated from the first region by a second insulating layer. Further, the coupling circuit is arranged in a third insulating layer formed on a second surface of the semiconductor layer and comprises at least two capacitors connected in series.