Invention Grant
- Patent Title: High frequency module, board equipped with antenna, and high frequency circuit board
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Application No.: US15705927Application Date: 2017-09-15
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Publication No.: US10925149B2Publication Date: 2021-02-16
- Inventor: Hideki Ueda
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JPJP2016-181093 20160916
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01Q21/06 ; H01Q1/22 ; H01Q1/38 ; H01L23/66 ; H01P3/08 ; H01Q1/12 ; H01Q1/48 ; H05K1/11 ; H05K3/34 ; H01L23/552 ; H01L23/60 ; H01L23/00

Abstract:
A first board includes a first ground plane, a first ground land, a first transmission line, and a first signal land connected to the first transmission line, wherein the first ground land and the first signal land are formed on the same surface. A second board includes a second ground plane, a second ground land, a second transmission line, and a second signal land connected to the second transmission line, wherein the second ground land and the second signal land are formed on a surface opposing the first board. The second ground land and the second signal land oppose the first ground land and the first signal land, respectively. A conduction member connects the first ground land and the second ground land. The first signal land and the second signal land are connected by capacitance coupling without using any conductor.
Public/Granted literature
- US20180084637A1 HIGH FREQUENCY MODULE, BOARD EQUIPPED WITH ANTENNA, AND HIGH FREQUENCY CIRCUIT BOARD Public/Granted day:2018-03-22
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