- Patent Title: System and method to provide connection pads for high speed cables
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Application No.: US16385569Application Date: 2019-04-16
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Publication No.: US10925153B2Publication Date: 2021-02-16
- Inventor: Sandor Farkas , Bhyrav M. Mutnury
- Applicant: DELL PRODUCTS, LP
- Applicant Address: US TX Round Rock
- Assignee: DELL PRODUCTS, LP
- Current Assignee: DELL PRODUCTS, LP
- Current Assignee Address: US TX Round Rock
- Agency: Larson Newman, LLP
- Main IPC: H05K7/10
- IPC: H05K7/10 ; H05K7/12 ; H05K1/02 ; H05K1/11 ; H05K3/30 ; H05K3/40
Abstract:
A printed circuit board includes first and second signal pads, and first, second, and third ground pads. The first and second signal pads and the first and second ground pads are arranged in a line with the first and second signal pads between the first and second ground pads. The third ground pad is arranged between the first and second signal pads but is not in line with the first and second signal pads.
Public/Granted literature
- US20200337149A1 System and Method to Provide Connection Pads for High Speed Cables Public/Granted day:2020-10-22
Information query
