A sensor device including: a sensor portion; a casing portion housing the sensor portion; an elastic portion that is provided in contact with the casing portion between the sensor portion and the casing portion and has a material having smaller elastic modulus than elastic modulus of the casing portion; and an adhesive that is provided between the sensor portion and the casing portion is provided. The adhesive may have an interface between the elastic portion and the adhesive. The elastic portion may have the same material as the adhesive. The elastic portion may have smaller elastic modulus than the adhesive.