Invention Grant
- Patent Title: Circuit device, tester, inspection device, and method of adjusting bending of circuit board
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Application No.: US16507764Application Date: 2019-07-10
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Publication No.: US10928441B2Publication Date: 2021-02-23
- Inventor: Koichi Kanosue
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer
- Priority: JPJP2018-132061 20180712
- Main IPC: G01R31/28
- IPC: G01R31/28 ; H05K1/02 ; H05K7/14

Abstract:
There is provided a circuit device including: a circuit board; a housing configured to support the circuit board; and a bending adjuster configured to adjust bending of the circuit board supported by the housing, wherein the circuit board is supported by the housing by having a portion of the circuit board fixed to the housing, and wherein the bending adjuster includes: a reference member mounted on the housing and spaced apart from a non-fixed portion of the circuit board supported by the housing, the non-fixed portion being a portion that is not fixed to the housing; and a distance adjuster configured to adjust a distance between the non-fixed portion of the circuit board and the reference member such that the circuit board is deformed.
Public/Granted literature
- US20200018790A1 CIRCUIT DEVICE, TESTER, INSPECTION DEVICE, AND METHOD OF ADJUSTING BENDING OF CIRCUIT BOARD Public/Granted day:2020-01-16
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