A photosensitive resin composition comprises a modified polyimide polymer having a chemical structural formula of: photosensitive monomers, a bisphenol A epoxy resin, a photo-initiator, and a pigment. The modified polyimide polymer is made by a reaction of a polyimide polymer having a chemical structural formula of: and glycidyl methacrylate. The carboxyl group of the polyimide polymer reacts with the epoxy group of glycidyl methacrylate. The polyimide polymer is made by a reaction of dianhydride monomers each having an A group, diamine monomers each having the R group, diamine monomers each having the R1 group, and diamine monomers each having the R2 group. The diamine monomer having R group is a diamine compound having R group bonding with the carboxyl group. The diamine monomer having R1 group is a soft long-chain diamine monomer. R2 group comprises at least one secondary amine group or tertiary amine group.