A heat dissipation module including a chamber, a first cooling member, and a barrier part is provided. The chamber has an accommodating space, at least one inlet, and at least one outlet. The at least one inlet is disposed in a first side wall of the chamber and communicates with the accommodating space. The at least one outlet is disposed in a second side wall of the chamber away from the at least one inlet and communicates with the accommodating space. The first cooling member is disposed in the accommodating space. The first cooling member has a guiding surface which extends obliquely upward. The barrier part is disposed outside the guiding surface of the first cooling member and has at least one through hole.