Invention Grant
- Patent Title: Packing structure
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Application No.: US16666417Application Date: 2019-10-29
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Publication No.: US10930085B2Publication Date: 2021-02-23
- Inventor: Shu-Hsien Chung , Jhih-Hsien Wu , Chung-Hsien Lee , Ming-Haw Wang
- Applicant: Acer Incorporated
- Applicant Address: TW New Taipei
- Assignee: Acer Incorporated
- Current Assignee: Acer Incorporated
- Current Assignee Address: TW New Taipei
- Agency: JCIPRNET
- Priority: TW105120381 20160628
- Main IPC: G06T19/00
- IPC: G06T19/00 ; G02B27/01 ; G02B27/02 ; G06F3/041

Abstract:
A packing structure including a first packing component, a second packing component, and two lenses is provided. The second packing component is adapted to be combined with the first packing component detachably, such that a containing space is formed between the first packing component and the second packing component. The containing space is adapted to contain an electronic device. The two lenses are disposed on the second packing component. An image displayed by a display surface of the electronic device is adapted to be transmitted to outside of the containing space through the two lenses, so as to form a virtual reality image.
Public/Granted literature
- US20200066053A1 PACKING STRUCTURE Public/Granted day:2020-02-27
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