In an electronic component, a first ground land and a first hot land are provided on a mounting surface of a first substrate. A semiconductor chip is mounted on a first surface and a first ground land and a first hot land are provided on a second surface of a second substrate, and the second surface faces the mounting surface of the first substrate. A three-terminal capacitor is between the first substrate and second substrates. The first ground land of the first substrate and a first ground electrode of the three-terminal capacitor are connected to each other with a solder bump interposed therebetween, the first hot land of the first substrate and a first hot electrode of the three-terminal capacitor are connected to each other with a solder bump interposed therebetween, the first ground land of the second substrate and a second ground electrode of the three-terminal capacitor are connected to each other with a solder bump interposed therebetween, and the first hot land of the second substrate and a second hot electrode of the three-terminal capacitor are connected to each other with a solder bump interposed therebetween.