Invention Grant
- Patent Title: Stacked transparent pixel structures for image sensors
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Application No.: US15724027Application Date: 2017-10-03
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Publication No.: US10930709B2Publication Date: 2021-02-23
- Inventor: Mark A. Lamkin
- Applicant: Lockheed Martin Corporation
- Applicant Address: US MD Bethesda
- Assignee: Lockheed Martin Corporation
- Current Assignee: Lockheed Martin Corporation
- Current Assignee Address: US MD Bethesda
- Agency: Baker Botts L.L.P.
- Main IPC: H01L27/32
- IPC: H01L27/32 ; H01L51/52 ; H01L27/146 ; H01L51/50 ; H01L33/08 ; H01L33/42 ; H01L27/30
Abstract:
In one embodiment, a pixel for an image sensor includes a first subpixel and a second subpixel stacked on top of the first subpixel. Each of the first and second subpixels include a polygon shape. Each of the first and second subpixels include a photodetector layer, a transparent cathode layer, and a transparent anode layer.
Public/Granted literature
- US20190103444A1 Stacked Transparent Pixel Structures for Image Sensors Public/Granted day:2019-04-04
Information query
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