Invention Grant
- Patent Title: Silicon carbide semiconductor device and method of manufacturing a silicon carbide semiconductor device
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Application No.: US16660129Application Date: 2019-10-22
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Publication No.: US10930741B2Publication Date: 2021-02-23
- Inventor: Makoto Utsumi , Tsuyoshi Araoka
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki
- Agency: Rabin & Berdo, P.C.
- Priority: JPJP2018-244471 20181227
- Main IPC: H01L29/10
- IPC: H01L29/10 ; H01L29/16 ; H01L29/423 ; H01L21/04 ; H01L29/66 ; H01L21/02

Abstract:
A p-type base region is configured by a p−-type channel region and a p-type high-impurity-concentration region adjacent to the channel region in a horizontal direction. A point having a highest impurity concentration in the high-concentration region is located at a position separated from a lower surface of an n++-type source region. The impurity concentration in the high-impurity-concentration region decreases toward the front surface of the semiconductor substrate and the rear surface of the semiconductor substrate in the depth direction. The impurity concentration in the high-impurity-concentration region decreases toward the low-impurity-concentration region in a direction parallel to the front surface of the semiconductor substrate.
Public/Granted literature
- US20200212183A1 SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SILICON CARBIDE SEMICONDUCTOR DEVICE Public/Granted day:2020-07-02
Information query
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