Invention Grant
- Patent Title: Extension region for a semiconductor device
-
Application No.: US16696451Application Date: 2019-11-26
-
Publication No.: US10930764B2Publication Date: 2021-02-23
- Inventor: Kandabara Tapily , Jeffrey Smith , Nihar Mohanty , Anton J. deVilliers
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/775 ; H01L21/8238 ; H01L21/822 ; H01L29/78 ; H01L29/423 ; H01L27/06 ; H01L27/092 ; H01L29/786 ; B82Y10/00 ; H01L29/06 ; H01L29/08 ; H01L29/10 ; H01L29/165 ; H01L29/49

Abstract:
A semiconductor device herein includes doped extension regions for silicon and silicon germanium nanowires. The nanowires can be selectively grown and recessed into a gate spacer. The semiconductor device can include a gate structure including the gate spacer; the nanowire or channel extending through the gate structure such that an end of the channel is recessed within a recess in said gate spacer; an extension region in contact with the end of the channel within the recess, the extension region being formed of an extension material having a different composition than a channel material of the channel such that a strain is provided in the channel; and a source-drain contact in contact with the extension region and adjacent to the gate structure.
Public/Granted literature
- US20200098897A1 EXTENSION REGION FOR A SEMICONDUCTOR DEVICE Public/Granted day:2020-03-26
Information query
IPC分类: