Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16559015Application Date: 2019-09-03
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Publication No.: US10930773B2Publication Date: 2021-02-23
- Inventor: Hiroshi Kono , Teruyuki Ohashi , Masaru Furukawa
- Applicant: Kabushiki Kaisha Toshiba , Toshiba Electronic Devices & Storage Corporation
- Applicant Address: JP Tokyo; JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba,Toshiba Electronic Devices & Storage Corporation
- Current Assignee: Kabushiki Kaisha Toshiba,Toshiba Electronic Devices & Storage Corporation
- Current Assignee Address: JP Tokyo; JP Tokyo
- Agency: White & Case LLP
- Priority: JP2019-038034 20190301
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/08 ; H01L29/16 ; H01L29/36 ; H01L29/10 ; H01L29/423 ; H01L29/165 ; H01L29/872

Abstract:
A semiconductor device according to an embodiment includes first electrode; second electrode; silicon carbide layer between the first electrode and the second electrode, the silicon carbide layer having first and second plane, the silicon carbide layer including first silicon carbide region of first-conductivity-type, second silicon carbide region and third silicon carbide region between the first silicon carbide region and the first plane, fourth silicon carbide region between the second silicon carbide region and the first plane, the fourth silicon carbide region contacting the first electrode, fifth silicon carbide region between the second silicon carbide region and the third silicon carbide region, the fifth silicon carbide region having a higher first-conductivity-type impurity concentration than the first silicon carbide region, sixth silicon carbide region between the fifth silicon carbide region and the first plane, the sixth silicon carbide region contacting the first electrode; gate electrode facing the second silicon carbide region.
Public/Granted literature
- US20200279940A1 SEMICONDUCTOR DEVICE Public/Granted day:2020-09-03
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