A dual contact Insulation Displacement Contact (IDC) header pin comprised of an upper section, a lead-in section, and a retention section. The upper section of the pin has at a plurality of pin barbs to allow it to be retained into a housing. The side walls and back of the upper portion create a C-shape to the upper portion. Each IDC header pin has two blades to contact a wire and displace the insulation thereof. The lead-in section serves to lead the IDC header pin into a housing and prevent stubbing of the pin during insertion. The retention section of the pin has a plurality of rib-like projections allowing the pin to be retained into respective holes in a PCB by applying normal force and an interference fit. An embodiment is open, with front protrusions on the upper section, and another embodiment is closed, having two front walls on the upper section.