Invention Grant
- Patent Title: Circuit device
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Application No.: US16624326Application Date: 2018-06-27
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Publication No.: US10931046B2Publication Date: 2021-02-23
- Inventor: Hirokazu Komori , Hisashi Sawada , Naomichi Kawashima , Hirokazu Eguchi
- Applicant: AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Applicant Address: JP Yokkaichi; JP Yokkaichi; JP Osaka
- Assignee: AutoNetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee: AutoNetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee Address: JP Yokkaichi; JP Yokkaichi; JP Osaka
- Agent Gerald E. Hespos; Michael J. Porco; Matthew T. Hespos
- Priority: JPJP2017-131185 20170704
- International Application: PCT/JP2018/024275 WO 20180627
- International Announcement: WO2019/009147 WO 20190110
- Main IPC: H01R12/71
- IPC: H01R12/71 ; H01R13/52

Abstract:
An ECU (1) includes a circuit board (10), a connector (20) fixed to the circuit board (10), and a resin portion (50) covering the circuit board (10) and the connector (20). The connector (20) includes a connector housing (21) having a terminal holding wall (22) that separates the internal space from the external space, and terminal fittings (41) extend through the terminal holding wall (22). The connector housing (21) includes a surrounding wall (27) disposed on the lateral surface of the terminal holding wall (22) to surround the terminal fittings (41). A potting material (28) is disposed inside the surrounding wall (27) and separates the terminal holding wall (22) from the resin portion (50). This can prevent a melted resin from entering a hood (24) through press fitting holes (23) at the time of forming the resin portion (50) by mold forming.
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