- Patent Title: High speed connector assembly, socket connector and grounding plate
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Application No.: US16709950Application Date: 2019-12-11
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Publication No.: US10931063B2Publication Date: 2021-02-23
- Inventor: Hsin-Chih Chen
- Applicant: OUPIIN ELECTRONIC (KUNSHAN) CO., LTD.
- Applicant Address: CN Kunshan
- Assignee: OUPIIN ELECTRONIC (KUNSHAN) CO., LTD.
- Current Assignee: OUPIIN ELECTRONIC (KUNSHAN) CO., LTD.
- Current Assignee Address: CN Kunshan
- Agent Mark M. Friedman
- Priority: CN201811539407.6 20181217,CN201822110865.X 20181217
- Main IPC: H01R13/6586
- IPC: H01R13/6586 ; H01R13/436 ; H01R13/6596 ; H01R13/05 ; H01R107/00

Abstract:
A high-speed connector assembly, a socket connector and a grounding plate are disclosed in the present invention. The grounding plate disposes multiple grounding arms and multiple shielding pieces, which are arranged in a serpentine pattern for surrounding front mating portions of each pair of differential signal socket terminals to be in a U-shaped state, thereby providing electromagnetic shielding. The grounding plate further disposes multiple spring fingers, which can be used to connect adjacent grounding plates for forming a common grounding path, and further reducing signal crosstalk of adjacent differential pairs. The grounding plate of the present invention can further contact with a corresponding shielding shell of a plug connector to form a complete grounding path, and ensure more stable and reliable signal transmission quality.
Public/Granted literature
- US2638732A Double twist throwing spindle device Public/Granted day:1953-05-19
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