Invention Grant
- Patent Title: Chip failure detection method and device
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Application No.: US16585415Application Date: 2019-09-27
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Publication No.: US10931487B2Publication Date: 2021-02-23
- Inventor: Jian Sun , Lin Lin , Ziqiang Guo
- Applicant: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. , BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing; CN Beijing
- Assignee: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.,BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing; CN Beijing
- Agency: Myers Bigel, P.A.
- Priority: CN201910059367.3 20190122
- Main IPC: H04L25/49
- IPC: H04L25/49 ; H04L1/20

Abstract:
Embodiments herein provide a method for detecting a failure of a chip. The method includes dividing a plurality of channels of the chip into multiple channel groups, providing an input bit stream to each channel group of the multiple channel groups and monitoring whether there is a difference between an output bit stream of each channel in the channel group and the input bit stream, and determining based on the difference whether each of the multiple channel groups is an abnormal channel group. Input bit streams provided to respective channels in a same channel group are identical.
Public/Granted literature
- US20200235964A1 CHIP FAILURE DETECTION METHOD AND DEVICE Public/Granted day:2020-07-23
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