Invention Grant
- Patent Title: Speaker module
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Application No.: US16703890Application Date: 2019-12-05
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Publication No.: US10932023B2Publication Date: 2021-02-23
- Inventor: Lu Feng
- Applicant: AAC Technologies Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: AAC Technologies Pte. Ltd.
- Current Assignee: AAC Technologies Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: W&G Law Group LLP
- Priority: CN201811631125.9 20181229
- Main IPC: H04R1/02
- IPC: H04R1/02

Abstract:
The present invention provides a speaker module, including: a housing; a speaker unit having a frame and a working pad fixed to the frame for electrically connecting the speaker unit to an external circuit; a cover engaging with the frame for forming an accommodating space for receiving the speaker unit. The cover includes a conductive part formed thereon, a conductive pin formed on one side of the cover for electrically connecting with the working pad of the speaker unit, and a conductive terminal formed on the other side of the cover for electrically connecting with the external circuit.
Public/Granted literature
- US20200213695A1 Speaker Module Public/Granted day:2020-07-02
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