Invention Grant
- Patent Title: Chip resistor, method of producing chip resistor and chip resistor packaging structure
-
Application No.: US16298636Application Date: 2019-03-11
-
Publication No.: US10932367B2Publication Date: 2021-02-23
- Inventor: Kentaro Naka
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JPJP2011-110236 20110517
- Main IPC: H01C1/01
- IPC: H01C1/01 ; H01C17/28 ; H01C17/00 ; H01C1/14 ; H05K1/18
Abstract:
A method for efficiently manufacturing chip resistors is provided.
A method for efficiently manufacturing chip resistors includes the steps of preparing at least three conductive elongated boards made of an electrically conductive material and a resistive member made of a resistive material, arranging the at least three conductive elongated boards apart from each other along a width direction crossing a longitudinal direction in which one of the at least three conductive elongated boards is elongated, forming a resistor aggregate by bonding the resistive member to the at least three conductive elongated boards, and collectively dividing the resistor aggregate into a plurality of chip resistors by punching so that each of the chip resistors includes two electrodes and a resistor portion bonded to the two electrodes.
A method for efficiently manufacturing chip resistors includes the steps of preparing at least three conductive elongated boards made of an electrically conductive material and a resistive member made of a resistive material, arranging the at least three conductive elongated boards apart from each other along a width direction crossing a longitudinal direction in which one of the at least three conductive elongated boards is elongated, forming a resistor aggregate by bonding the resistive member to the at least three conductive elongated boards, and collectively dividing the resistor aggregate into a plurality of chip resistors by punching so that each of the chip resistors includes two electrodes and a resistor portion bonded to the two electrodes.
Public/Granted literature
- US20190208639A1 CHIP RESISTOR, METHOD OF PRODUCING CHIP RESISITOR AND CHIP RESISTOR PACKAGING STRUCTURE Public/Granted day:2019-07-04
Information query
