Invention Grant
- Patent Title: Footwear midsole with warped lattice structure and method of making the same
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Application No.: US15898000Application Date: 2018-02-15
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Publication No.: US10932521B2Publication Date: 2021-03-02
- Inventor: Jacques Perrault , Derek Andrew Luther , Berin Skye B , Marco Florian Kormann , Pradeepan Indrakumar , Florian Josel Fick , Felix Braun , Yuehong Tu , Andrew Jacob Schneider , Christian Siegl , Brendan Epley
- Applicant: adidas AG
- Applicant Address: DE Herzogenaurach
- Assignee: adidas AG
- Current Assignee: adidas AG
- Current Assignee Address: DE Herzogenaurach
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: A43B13/18
- IPC: A43B13/18 ; A43B1/00 ; A43B1/10 ; A43B13/04 ; A43B13/14 ; A61B5/00 ; B33Y10/00 ; B33Y80/00 ; B29C64/124 ; B29C64/393 ; B33Y50/02 ; A43D1/02 ; A61B5/11 ; B33Y50/00 ; B29L31/50 ; A43B5/06 ; A61B5/103 ; A43B5/12 ; A43B5/00 ; A43B5/14 ; A43B5/10 ; A43B5/02 ; A61B5/0205 ; A61B5/024

Abstract:
A midsole for an article of footwear including a three dimensional mesh including interconnected unit cells and methods of making the same. The interconnected unit cells each include a plurality of struts defining a three dimensional shape. The interconnected unit cells are connected at nodes having a valence number defined by the number of struts connected at that node. The valence number of the nodes may vary to provide customized characteristics to zones or portions of the midsole. The plurality of interconnected unit cells may be organized in a warped cubic lattice structure. The warped cubic lattice structure and the size/shape of interconnected unit cells may vary to provide customized characteristics to zones or portions of the midsole. The three dimensional mesh may be customized based on a biometric data profile for an individual, or group of individuals. The midsole may be manufactured using an additive manufacturing process.
Public/Granted literature
- US20180271211A1 FOOTWEAR MIDSOLE WITH WARPED LATTICE STRUCTURE AND METHOD OF MAKING THE SAME Public/Granted day:2018-09-27
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