Invention Grant
- Patent Title: Systems and methods for implanting a medical electrical lead
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Application No.: US14257519Application Date: 2014-04-21
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Publication No.: US10933230B2Publication Date: 2021-03-02
- Inventor: Melissa G. T. Christie , Amy E. Thompson-Nauman , Noah D. Barka , Rick D. McVenes
- Applicant: Medtronic, Inc.
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Main IPC: A61N1/05
- IPC: A61N1/05 ; A61M5/14 ; A61B17/34 ; A61B17/00 ; A61B17/32
Abstract:
Devices and implantation methods utilizing subcutaneous placement into a patient are disclosed for the insertion, advancement and positioning of a subcutaneous implantable medical device (SIMD) such as a medical electrical lead. The device for implanting the SIMD is configured having a pre-biased distal curve for creating a pathway to an implant location within a substernal space.
Public/Granted literature
- US20140330208A1 SYSTEMS AND METHODS FOR IMPLANTING A MEDICAL ELECTRICAL LEAD Public/Granted day:2014-11-06
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