Invention Grant
- Patent Title: Soldering method and soldering structure
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Application No.: US15952694Application Date: 2018-04-13
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Publication No.: US10933482B2Publication Date: 2021-03-02
- Inventor: Akio Kato , Shinpei Kato , Hisashi Karube
- Applicant: Yazaki Corporation
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JPJP2017-120306 20170620
- Main IPC: B23K1/00
- IPC: B23K1/00 ; B23K1/20 ; H01R43/02 ; H01R4/02 ; H01R13/58

Abstract:
Provided is a soldering method for soldering a tip end of an electric wire to a soldering portion of a metallic terminal which allows the soldering to be performed with excellent workability. The method includes a damming structure forming step forming a damming structure at a periphery of the soldering portion to dam a solder which is supplied in a molten state with a flux to the soldering portion to keep the solder at the soldering portion, an electric wire setting step setting the tip end of the electric wire at the soldering portion ready for soldering, and a solder supplying step supplying the solder in the molten state with the flux to the soldering portion to perform the soldering.
Public/Granted literature
- US20180361491A1 SOLDERING METHOD AND SOLDERING STRUCTURE Public/Granted day:2018-12-20
Information query
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