Invention Grant
- Patent Title: Polishing apparatus
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Application No.: US15438505Application Date: 2017-02-21
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Publication No.: US10933507B2Publication Date: 2021-03-02
- Inventor: Taro Takahashi , Akira Nakamura , Hiroaki Shibue , Mitsuo Tada
- Applicant: EBARA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: EBARA CORPORATION
- Current Assignee: EBARA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: BakerHostetler
- Priority: JPJP2016-031970 20160223
- Main IPC: B24B37/013
- IPC: B24B37/013 ; B24B37/20 ; B24B37/30 ; H01L21/304 ; H01L21/67 ; H01L21/66

Abstract:
An end-point detection sensor 50 detects an end point of polishing, the end-point detection sensor 50 being arranged in a polishing table 100. The end-point detection sensor 50 has a pot core. The pot core 60 has a bottom portion 61a, a magnetic core base portion 61b and a peripheral wall base portion 61c. The end-point detection sensor 50 has an exciting coil 62, and a detection coil 63. The back surface 101b of the polishing pad 101 has a space 30 which is arranged at a portion facing the polishing table 100 and houses a magnetic core extension portion 8 and a peripheral wall extension portion 11. The magnetic core extension portion 8 and the peripheral wall extension portion 11 extending to the space 30 are located in the space 30.
Public/Granted literature
- US20170259394A1 POLISHING APPARATUS Public/Granted day:2017-09-14
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