Invention Grant
- Patent Title: Liquid ejection head substrate and method for manufacturing the same
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Application No.: US16701996Application Date: 2019-12-03
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Publication No.: US10933635B2Publication Date: 2021-03-02
- Inventor: Souta Takeuchi , Takeru Yasuda , Kazuaki Shibata , Taichi Yonemoto
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: CANON KABUSHIKI KAISHA
- Current Assignee: CANON KABUSHIKI KAISHA
- Current Assignee Address: JP Tokyo
- Agency: Venable LLP
- Priority: JPJP2018-235022 20181217
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16

Abstract:
Provided is a liquid ejection head substrate including: a substrate; a liquid ejection element that generates liquid ejection energy on the substrate; and an electrode pad that is electrically connected to the liquid ejection element, in which the electrode pad includes a barrier metal layer and a bonding layer on the barrier metal layer, and an end side surface of the barrier metal layer is covered with a silicon-based film containing carbon.
Information query
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