Invention Grant
- Patent Title: Aluminum based solderable contact
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Application No.: US16185841Application Date: 2018-11-09
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Publication No.: US10933675B2Publication Date: 2021-03-02
- Inventor: Shallu Soneja , Gokce Gulsoy , Yiliang Wu , Xiao Zhou , Helge Schmidt , Soenke Sachs , Felix Greiner
- Applicant: TE Connectivity Corporation , TE Connectivity Germany GmbH , Tyco Electronics (Shanghai) Co. Ltd.
- Applicant Address: US PA Berwyn; DE Bensheim; CN Shanghai
- Assignee: TE Connectivity Corporation,TE Connectivity Germany GmbH,Tyco Electronics (Shanghai) Co. Ltd.
- Current Assignee: TE Connectivity Corporation,TE Connectivity Germany GmbH,Tyco Electronics (Shanghai) Co. Ltd.
- Current Assignee Address: US PA Berwyn; DE Bensheim; CN Shanghai
- Agency: Barley Snyder
- Priority: CN201711103931.4 20171110
- Main IPC: B23K26/00
- IPC: B23K26/00 ; B41M3/00 ; B23K1/00 ; B23K1/005 ; B23K26/354 ; B23K3/06 ; B23K1/20 ; B23K1/19 ; B23K103/10 ; B23K101/42 ; B23K103/08

Abstract:
A method of producing a solderable aluminum contact comprises formulating an ink, applying the ink to an aluminum substrate to form an ink layer on a surface of the aluminum substrate, and melting the ink layer. The ink includes a solderable element that is conductive. The melting of the ink layer forms an alloy on the surface of the aluminum substrate including the solderable element.
Public/Granted literature
- US20190143726A1 Aluminum Based Solderable Contact Public/Granted day:2019-05-16
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