Invention Grant
- Patent Title: Epoxy resin, epoxy resin composition, inorganic filler-containing epoxy resin composition, resin sheet, cured product, and epoxy compound
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Application No.: US15539974Application Date: 2015-12-25
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Publication No.: US10934387B2Publication Date: 2021-03-02
- Inventor: Hideyuki Katagi , Kenji Tanaka , Yoshitaka Takezawa , Haruaki Sue , Shinichi Kosugi
- Applicant: HITACHI CHEMICAL COMPANY, LTD.
- Applicant Address: JP Tokyo
- Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Fitch, Even, Tabin & Flannery, LLP
- Priority: JPJP2014-266106 20141226
- International Application: PCT/JP2015/086373 WO 20151225
- International Announcement: WO2016/104772 WO 20160630
- Main IPC: C08G59/24
- IPC: C08G59/24 ; C08J5/18 ; C08G59/62
Abstract:
An epoxy resin obtained by a reaction of an epoxy resin monomer having a mesogen backbone and having two glycidyl groups in one molecule with a divalent phenol compound having, as substituents, two hydroxyl groups on one benzene ring, in which a number average molecular weight in gel permeation chromatographic measurement is from 600 to 2,500.
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