Invention Grant
- Patent Title: Substrate processing apparatus, substrate loading method, and substrate processing method
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Application No.: US16601781Application Date: 2019-10-15
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Publication No.: US10934618B2Publication Date: 2021-03-02
- Inventor: Tomoyuki Nagata
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer
- Priority: JPJP2018-195404 20181016
- Main IPC: H01L21/677
- IPC: H01L21/677 ; H01L21/673 ; C23C16/44
Abstract:
There is provided a substrate processing apparatus, including: a cylindrical reaction tube having a lower end opening; a lid configured to open and close the lower end opening of the reaction tube; a substrate holder mounted on the lid and configured to hold a plurality of substrates at vertical intervals in multiple stages; and an inner tube mounted on the lid and configured to cover the substrate holder.
Information query
IPC分类:
