A heat shield assembly is provided for shielding a wire harness that is associated with a sensor in communication with a heat source. The heat shield assembly includes a base plate having a primary aperture that is configured to allow passage of the wire harness therethrough. The primary aperture is disposed in alignment with a hole defined on a shroud of the heat source. The heat shield assembly also includes a pair of walls extending upwardly from a pair of opposite edges of the base plate. Further, the heat shield assembly also includes a pair of ledge members that extend laterally from a pair of first ends associated with the pair of walls. Furthermore, the heat shield assembly also includes a pair of thermal diverter plates that extend angularly from a pair of second ends associated with the pair of ledge members.