The invention describes a LED lighting unit comprising a heatsink; an LED module mounted onto the heatsink, which LED module comprises a carrier, a number of LED dies mounted on the carrier, and LED electrode contacts formed on the carrier; an overmould formed to encase the heatsink and to expose the mounting surface region of the heatsink upon which the LED module is mounted; and an electrical interface also encased in the overmould and arranged to electrically connect the LED module to a power supply. The invention further describes a method of manufacturing such an LED lighting unit.