Invention Grant
- Patent Title: Lithography patterning with flexible solution adjustment
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Application No.: US16741463Application Date: 2020-01-13
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Publication No.: US10935888B2Publication Date: 2021-03-02
- Inventor: Chung-Cheng Wang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: G03F7/32
- IPC: G03F7/32 ; G03F7/30 ; G03F7/20 ; G03F7/40

Abstract:
A system for lithography patterning includes a first supply pipe for supplying a first solution, a second supply pipe for supplying a second solution, and a third supply pipe coupled to the first and second supply pipes for receiving the first and second solutions respectively and mixing the first and second solutions into a mixture. The third supply pipe couples to the first and second supply pipe at a junction. At the junction the first solution in the first supply pipe flows in a direction opposite to that of the second solution in the second supply pipe. The system further includes a first control unit coupled to the first supply pipe and configured to control a flow rate of the first solution, and a second control unit coupled to the second supply pipe and configured to control a flow rate of the second solution.
Public/Granted literature
- US20200150540A1 Lithography Patterning with Flexible Solution Adjustment Public/Granted day:2020-05-14
Information query
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