Invention Grant
- Patent Title: Planning method for power metal lines
-
Application No.: US16704109Application Date: 2019-12-05
-
Publication No.: US10936784B2Publication Date: 2021-03-02
- Inventor: Hsin-Wei Pan , Li-Yi Lin , Yun-Chih Chang , Shu-Yi Kao
- Applicant: REALTEK SEMICONDUCTOR CORP.
- Applicant Address: TW Hsinchu
- Assignee: REALTEK SEMICONDUCTOR CORP.
- Current Assignee: REALTEK SEMICONDUCTOR CORP.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: TW108123330 20190702
- Main IPC: G06F30/3953
- IPC: G06F30/3953 ; G06F30/392

Abstract:
A planning method for power metal lines is provided. The planning method includes selecting a block to plan, the block including a first metal layer and a second metal layer therebelow. The first metal layer includes a plurality of first metal lines along a first direction and the second metal layer includes a plurality of second metal lines along a second direction. The block includes a length in the first direction and a width in the second direction. According to a ratio of the length and the width of the block, a line width adjustment procedure is performed to adjust a first line width of each of the first metal lines and a second line width of each of the second metal lines, so that routing congestion can be avoided without affecting the IR drop.
Public/Granted literature
- US20210004520A1 PLANNING METHOD FOR POWER METAL LINES Public/Granted day:2021-01-07
Information query