Invention Grant
- Patent Title: Solid state memory case with enhanced cooling
-
Application No.: US16480665Application Date: 2017-03-17
-
Publication No.: US10937464B2Publication Date: 2021-03-02
- Inventor: Brian J. Long
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- International Application: PCT/US2017/022909 WO 20170317
- International Announcement: WO2018/169545 WO 20180920
- Main IPC: G11B33/14
- IPC: G11B33/14 ; H05K7/20 ; G06F1/20 ; G06F1/18

Abstract:
A case suitable for solid state memory is described that offers enhanced cooling. In one example, a memory case includes a base, a cover having a plurality of fins on a top of the cover, channels between the fins, defined by the fins, and a ramp extending from a front on the top of the cover to the channels, and an inner cavity defined by the base and the cover to house a solid state memory.
Public/Granted literature
- US20200174533A1 SOLID STATE MEMORY CASE WITH ENHANCED COOLING Public/Granted day:2020-06-04
Information query
IPC分类: