Invention Grant
- Patent Title: Conduction path and wire harness
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Application No.: US16622494Application Date: 2018-06-26
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Publication No.: US10937567B2Publication Date: 2021-03-02
- Inventor: Hirokazu Nakai
- Applicant: SUMITOMO WIRING SYSTEMS, LTD.
- Applicant Address: JP Yokkaichi
- Assignee: SUMITOMO WIRING SYSTEMS, LTD.
- Current Assignee: SUMITOMO WIRING SYSTEMS, LTD.
- Current Assignee Address: JP Yokkaichi
- Agency: Oliff PLC
- Priority: JPJP2017-127269 20170629
- International Application: PCT/JP2018/024201 WO 20180626
- International Announcement: WO2019/004214 WO 20190103
- Main IPC: H01B7/04
- IPC: H01B7/04 ; H01B5/06 ; H01R11/12 ; H02G3/04 ; B60R16/02 ; H01B7/00 ; H01R4/18

Abstract:
A conduction path that includes a tubular conductor; a flexible conductor that has better flexibility than the tubular conductor and is connected to the tubular conductor; and a terminal that is connected to the flexible conductor, wherein: an end of the flexible conductor in a lengthwise direction thereof is fixed at a fixing portion of the tubular conductor in a state in which the end is inserted into the tubular conductor, the fixing portion includes a first deformed portion in which an outer peripheral wall of the tubular conductor is deformed radially inward and holds the flexible conductor, and a second deformed portion that is further deformed radially inward from the first deformed portion and is connected to the flexible conductor.
Public/Granted literature
- US20200258654A1 CONDUCTION PATH AND WIRE HARNESS Public/Granted day:2020-08-13
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