Invention Grant
- Patent Title: Ceramic electronic component and method of manufacturing ceramic electronic component
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Application No.: US16666560Application Date: 2019-10-29
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Publication No.: US10937593B2Publication Date: 2021-03-02
- Inventor: Takahiro Hirao , Takashi Ohara , Shu Hamada
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: Keating & Bennett, LLP
- Priority: JPJP2018-203738 20181030
- Main IPC: H01G4/012
- IPC: H01G4/012 ; H01G4/12 ; H01G4/33 ; H01G4/40 ; H01H85/02 ; H01H85/12

Abstract:
A ceramic electronic component includes a stack including ceramic layers and internal electrodes stacked alternately, and external electrodes provided on a surface of the stack and electrically connected to the internal electrodes. The internal electrodes include a melting trigger portion that melts earlier than any other portion. The ceramic layer adjacent to the internal electrode including the melting trigger portion includes a cavity. The cavity is provided at a position at which the cavity overlaps the melting trigger portion at least partially in a stacking direction of the internal electrodes. The cavity is open on a melting trigger portion side. A surface of at least one of the stack and the external electrodes is provided with an identifier that serves as a marker indicating use of the ceramic electronic component with the cavity vertically below the melting trigger portion.
Information query