Invention Grant
- Patent Title: Substrate processing apparatus, substrate processing method and recording medium
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Application No.: US16220164Application Date: 2018-12-14
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Publication No.: US10937673B2Publication Date: 2021-03-02
- Inventor: Madoka Fujimoto , Toyohisa Tsuruda , Masato Hosaka
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JPJP2017-241089 20171215
- Main IPC: G03F7/20
- IPC: G03F7/20 ; H01L21/67 ; H01L21/02 ; H05B45/10 ; H05B47/16

Abstract:
A period from a time point when a wafer W is carried into a housing 10 to a time point when the wafer W after being exposed is completely ready to be carried out is set as a single cycle. A time period before a next cycle is begun and after the single cycle is completed is referred to as a standby time period. When an illuminance in dummy light emission is set to be Id; an illuminance in exposure, Is; a time length of the dummy light emission, Td; and a time length of the exposure, Ts, by setting the Id to satisfy an expression of Id=(Tp/Td)·Iw−(Ts/Td)·Is, an average illuminance within the single cycle is maintained constant between substrates.
Public/Granted literature
- US20190189475A1 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND RECORDING MEDIUM Public/Granted day:2019-06-20
Information query
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