Invention Grant
- Patent Title: Self-aligned hard masks with converted liners
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Application No.: US16465510Application Date: 2016-12-30
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Publication No.: US10937689B2Publication Date: 2021-03-02
- Inventor: Manish Chandhok , Satyarth Suri , Tristan A. Tronic , Christopher J. Jezewski , Richard E. Schenker
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Patent Capital Group
- International Application: PCT/US2016/069359 WO 20161230
- International Announcement: WO2018/125175 WO 20180705
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L23/522 ; H01L21/02
Abstract:
In one embodiment, a trench may be formed in a dielectric surface, and the trenched may be lined with a liner. The trench may be filled with a metal, and the metal may be recessed below an opening of the trench. The liner may be converted into a dielectric, and a hard mask may be deposited into the trench.
Information query
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