Invention Grant
- Patent Title: Package structures and method of forming the same
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Application No.: US15882360Application Date: 2018-01-29
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Publication No.: US10937718B2Publication Date: 2021-03-02
- Inventor: Chen-Hua Yu , Chih-Hua Chen , Hao-Yi Tsai , Yu-Feng Chen
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L21/56 ; H01L21/768 ; H01L23/00 ; H01L23/13 ; H01L23/48 ; H01L23/538 ; H01L35/34 ; H01L23/498
Abstract:
Package structures and methods of forming package structures are described. A method includes placing a first package within a recess of a first substrate. The first package includes a first die. The method further includes attaching a first sensor to the first package and the first substrate. The first sensor is electrically coupled to the first package and the first substrate.
Public/Granted literature
- US20180166364A1 Package Structures and Method of Forming the Same Public/Granted day:2018-06-14
Information query
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