Invention Grant
- Patent Title: Package structure applied to driving apparatus of display
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Application No.: US16386533Application Date: 2019-04-17
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Publication No.: US10937724B2Publication Date: 2021-03-02
- Inventor: Ching-Yung Chen , Wen-Tsung Lin
- Applicant: Raydium Semiconductor Corporation
- Applicant Address: TW Hsinchu
- Assignee: Raydium Semiconductor Corporation
- Current Assignee: Raydium Semiconductor Corporation
- Current Assignee Address: TW Hsinchu
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H01L23/498 ; H01L21/677

Abstract:
A package structure applied to a driving apparatus of a display is disclosed. The driving apparatus includes at least one driving unit. The package structure includes a substrate, a first connecting unit, a second connecting unit and at least one package unit. The substrate is used to carry the driving unit. The first connecting unit is disposed at one side of the substrate. A longitudinal direction of the first connecting unit is parallel to a first direction. The second connecting unit is disposed at the other side of the substrate. A longitudinal direction of the second connecting unit is parallel to the first direction. The package unit is used to package the driving unit to form driving unit package object. A longitudinal direction of the driving unit package object is parallel to a second direction. The first direction and the second direction are perpendicular to each other.
Information query