An electronic device module includes a substrate, a first component disposed on a first surface of the substrate, a second component disposed on the first surface of the substrate, a first sealing portion to seal the first component, a second sealing portion to seal the second component, a shielding wall disposed between the first component and the second component. The shielding wall includes a bobbin disposed between the first sealing portion and the second sealing portion and a conductive portion to seal the bobbin. A shielding layer of a conductive material is disposed along a surface formed by the first sealing portion, the second sealing portion, and the shielding wall.