Invention Grant
- Patent Title: Package and manufacturing method thereof
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Application No.: US16739053Application Date: 2020-01-09
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Publication No.: US10937742B2Publication Date: 2021-03-02
- Inventor: Po-Hao Tsai
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L25/065 ; H01L25/00 ; H01L23/31 ; H01L23/498 ; H01L21/56 ; H01L23/16 ; H01L21/683
Abstract:
A package includes a plurality of dies, a wall structure, an encapsulant, and a redistribution structure. The wall structure surrounds at least one of the dies. The encapsulant includes a first portion, a second portion, and a third portion. The first portion is encircled by the wall structure. The second portion encircles the wall structure. The third portion connects the first portion and the second portion. The redistribution structure is disposed on the encapsulant and is electrically connected to the dies and the wall structure.
Information query
IPC分类:
