A semiconductor package is provided which includes a package substrate, a first die, a second die, an interconnection member and a number of bonding wires. The first die is disposed on the package substrate. The second die is disposed over the first die. The interconnection member is configured for coupling the first die and the second die and comprises a first connection plate, a second connection plate and a bump. The first connection plate is connected to the first die. The second connection plate is connected to the second die. The bump couples the first connection plate and the second connection plate. The bonding wires couple the interconnection member to the package substrate, the first die and the second die.