A semiconductor package includes a leadframe having a first island and second island each having an upper surface corresponding with an upper surface of the leadframe. One or more tie bars couple the first island with the second island. At least one tie bar has a protrusion extending from the upper surface of the leadframe and configured to substantially prevent a flow of a solder between the first and second islands. A first die couples with the leadframe at the first island and a second die couples with the leadframe at the second island. At least one of the tie bars has a recess at a lower surface of the leadframe. The leadframe includes a slit between the first and second island.