Disclosed herein are a chip packaging method and a device with packaged chips. The method includes: providing a support plate attached thereon with a first bonding layer; placing a plurality of chips onto the first bonding layer at intervals; performing a plastic packaging process to form a plastic packaging layer filling the gaps between the chips over the support plate, so that the plastic packaged chips are formed; removing the support plate and the first bonding layer to form the plastic packaged chips; forming an insulating layer over the plastic packaged chips, forming openings in the insulating layer and depositing metal in the openings to form a metal conducting layer and an interconnect circuitry; dicing the plastic packaged chips into a plurality of modules. The method reduces the distances between the chips, reduces the size of terminal products, and facilitates the miniaturization of the terminal products.