Invention Grant
- Patent Title: Semiconductor package and method for manufacturing the same
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Application No.: US16425354Application Date: 2019-05-29
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Publication No.: US10937772B2Publication Date: 2021-03-02
- Inventor: Yang-Che Chen , Chen-Hua Lin , Huang-Wen Tseng , Victor Chiang Liang , Chwen-Ming Liu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C., Intellectual Property Attorneys
- Agent Anthony King
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L25/16 ; H01L23/31 ; H01L49/02 ; H01L23/498 ; H01L21/56 ; H01L21/48 ; H01L21/78 ; H01L21/66
Abstract:
A semiconductor package structure includes an interconnection structure having a first surface and a second surface opposite to the first surface, a die surrounded by a molding compound over the first surface of the interconnection structure, and a passive device surrounded by a dielectric structure over the second surface of the interconnection structure. The passive device is electrically coupled to the die by the interconnection structure.
Public/Granted literature
- US20200381409A1 SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2020-12-03
Information query
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