Invention Grant
- Patent Title: Three dimensional memory arrays
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Application No.: US16550532Application Date: 2019-08-26
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Publication No.: US10937829B2Publication Date: 2021-03-02
- Inventor: Agostino Pirovano , Andrea Redaelli , Fabio Pellizzer , Innocenzo Tortorelli
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Brooks, Cameron & Huebsch, PLLC
- Main IPC: H01L27/24
- IPC: H01L27/24 ; H01L45/00 ; H01L27/115

Abstract:
In an example, a memory array may include a plurality of first dielectric materials and a plurality of stacks, where each respective first dielectric material and each respective stack alternate, and where each respective stack comprises a first conductive material and a storage material. A second conductive material may pass through the plurality of first dielectric materials and the plurality of stacks. Each respective stack may further include a second dielectric material between the first conductive material and the second conductive material.
Information query
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