Invention Grant
- Patent Title: Array substrate and method of manufacturing the same, display panel and display device
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Application No.: US16453534Application Date: 2019-06-26
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Publication No.: US10937849B2Publication Date: 2021-03-02
- Inventor: Hongfei Cheng
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: McDermott Will & Emery LLP
- Priority: CN201810821595.5 20180724
- Main IPC: H01L27/32
- IPC: H01L27/32 ; H01L27/02

Abstract:
An array substrate has a display area and a non-display area disposed at a periphery of the display area. The array substrate includes: a base substrate; at least one gate driver on array (GOA) circuit disposed on the base substrate and disposed in the non-display area; a planarization layer disposed on a side of the at least one GOA circuit facing away from the base substrate; and at least one electrostatic protection portion disposed on a surface of the planarization layer facing away from the base substrate and disposed in the non-display area. An orthographic projection of each GOA circuit on the base substrate is located within an outer boundary of an orthographic projection of a corresponding electrostatic protection portion on the base substrate.
Public/Granted literature
- US20200035773A1 ARRAY SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, DISPLAY PANEL AND DISPLAY DEVICE Public/Granted day:2020-01-30
Information query
IPC分类: