A method for manufacturing a power device is disclosed. The method for manufacturing the power device comprises: forming a first doped region on the semiconductor substrate; forming a plurality of second doped regions in a first region of the first doped region; and forming a plurality of third doped regions in a second region of the first doped region. A first charge compensation structure is formed by the first doped region and the plurality of second doped regions, the first charge compensation structure and the semiconductor substrate are located on current channel. A second charge compensation structure is formed by the first doped region and the plurality of third doped regions, the second charge compensation structure is configured to disperse continuous surface electric field of the power device. The power device manufactured by the method not only has a stable blocking voltage and an improved reliability, but also has a reduced on-resistance.