Invention Grant
- Patent Title: Structure of a fin field effect transistor (FinFET)
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Application No.: US16741315Application Date: 2020-01-13
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Publication No.: US10937894B2Publication Date: 2021-03-02
- Inventor: Wei-Yang Lee , Chih-Shan Chen
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L27/08 ; H01L21/02 ; H01L29/165 ; H01L29/06 ; H01L21/3065 ; H01L27/088

Abstract:
A fin field effect transistor (FinFET) includes a fin extending from a substrate, where the fin includes a lower region, a mid region, and an upper region, the upper region having sidewalls that extend laterally beyond sidewalls of the mid region. The FinFET also includes a gate stack disposed over a channel region of the fin, the gate stack including a gate dielectric, a gate electrode, and a gate spacer on either side of the gate stack. A dielectric material is included that surrounds the lower region and the first interface. A fin spacer is included which is disposed on the sidewalls of the mid region, the fin spacer tapering from a top surface of the dielectric material to the second interface, where the fin spacer is a distinct layer from the gate spacers. The upper region may include epitaxial source/drain material.
Public/Granted literature
- US20200152775A1 Structure of a Fin Field Effect Transistor (FinFET) Public/Granted day:2020-05-14
Information query
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