Invention Grant
- Patent Title: Semiconductor structure and manufacturing method thereof
-
Application No.: US15136309Application Date: 2016-04-22
-
Publication No.: US10937900B2Publication Date: 2021-03-02
- Inventor: Po-Chun Liu , Chi-Ming Chen , Yao-Chung Chang , Jiun-Lei Jerry Yu , Chen-Hao Chiang , Chung-Yi Yu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L29/20
- IPC: H01L29/20 ; H01L29/66 ; H01L29/778 ; H01L29/49

Abstract:
The present disclosure provides a semiconductor structure, including a substrate, a first III-V layer over the substrate, having a first band gap, and a second III-V layer over the first III-V layer, having a second band gap. The second III-V layer includes a first surface in contact with the first III-V layer and a second surface opposite to the first surface. The second band gap at the second surface is greater than the second band gap at the first surface. The present disclosure also provides a manufacturing method of the aforesaid semiconductor structure.
Public/Granted literature
- US20170222032A1 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2017-08-03
Information query
IPC分类: